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SET, founded in 1975 and Device Bonder division of SUSS MicroTec from June 93 to July 07, has been recently acquired by Replisaurus Technologies. The development of the production ECPR™ tools with Replisaurus widen the path of innovation while we continue expending our Die/Flip Chip Bonder Portfolio. In 2007 we introduced the FC300, high accuracy Die/Flip Chip Bonder for developing the 3D-IC processes, and the Kadett, entry model featuring automatic placement and bonding capabilities. Enjoy reading this news.
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