Letter of Managing Director SET, founded in 1975 and Device Bonder division of SUSS MicroTec from June 93 to July 07, has been recently acquired by Replisaurus Technologies. The development of the production ECPR™ tools with Replisaurus widen the path of innovation while we continue expending our Die/Flip Chip Bonder Portfolio. In 2007 we introduced the FC300, high accuracy Die/Flip Chip Bonder for developing the 3D-IC processes, and the Kadett, entry model featuring automatic placement and bonding capabilities. Enjoy reading this news.