SET, founded in 1975 and Device Bonder division of SUSS MicroTec from June 93 to July 07, has been recently acquired by Replisaurus Technologies. The development of the production ECPR™ tools with Replisaurus widen the path of innovation while we continue expending our Die/Flip Chip Bonder Portfolio. In 2007 we introduced the FC300, high accuracy Die/Flip Chip Bonder for developing the 3D-IC processes, and the Kadett, entry model featuring automatic placement and bonding capabilities. Enjoy reading this news.
Gael Schmidt

The SET FC150 primary function is to perform High Accuracy Die Attach or Flip Chip Bonding (Die-to-Die, Die Stacking, Die-to-Wafer).

However, this flexible and open platform includes all features required to perform Micro/Nano Replication by Hot Embossing Lithography, Soft Lithography or UV Nanoimprinting Lithography techniques.

High Quality and Reliable Bond often requires Oxygen Free Environment preventing Oxide formation during the Bonding Sequence, especially at High Temperature.

To adress this requirement, SET. has developed a Gas Confinement Chamber which not only prevents Pads and Bonding Medium Oxidation during the Bonding Sequence, but also enables Oxide Reduction prior to Bonding.

With the advent of 3D Integration concepts, the Die-to-Wafer population is a promising assembly strategies featuring heterogeneous integration capability and high yield thanks to the known good die approach.

Associated to a Chamber for Collective Reflow Bonding, it also offers high speed capability and Hermetic sealing applicable to Wafer Level Bonding on Microsystems.

Come and visit SET at the upcoming shows and conferences:

• Interconex, June 24-25, Paris, France, Booth #23
• Semicon West, July 15-17, San Francisco, CA, USA, Booth  #5787
• Micronora, September 23-26, Besançon, France, Booth #511
• Semicon Europa, October 7-9, Stuttgart, Germany, Booth #2130