Insights
Explore the World of Absolute Bonding Precision
The word of Gilbert Lecarpentier, Director Marketing
Dear readers, in this new issue of our information letter, we are proud to present the FC300R, our new High Accuracy Bonder with Robotics. We hope you will enjoy watching the video showing the loading operation in parallel with alignment and bonding, as well as the reading of our paper presented at IWLPC on the recent SET’s developments in C2W bonding for 3D-IC. Good reading!
Discover SET's FC300R, the easy-to-use platform ideal for high accuracy C2W bonding, die attach, flip-chipbonding and 3D integration. The FC300R is an automated version of the basic model of the High Force FC300; it addresses the needs of the pre-production environment.