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  Newsletter n°10
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Explore the World of Absolute Bonding Precision

 The word of Gilbert Lecarpentier, Director Marketing

Dear readers, in this new issue of our information letter, we are proud to present the FC300R, our new High Accuracy Bonder with Robotics. We hope you will enjoy watching the video showing the loading operation in parallel with alignment and bonding, as well as the reading of our paper presented at IWLPC on the recent SET’s developments in C2W bonding for 3D-IC. Good reading!


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 The new FC300R Bonder with Robotics for 3D-IC

Discover SET's FC300R, the easy-to-use platform ideal for high accuracy C2W bonding, die attach, flip-chip bonding and 3D integration. The FC300R is an automated version of the basic model of the High Force FC300; it addresses the needs of the pre-production environment.

 click on the picture to watch the FC300R video !



Full article
Technical Paper
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Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly, from IBM T.J. Watson Research Center.

 Full article
Technical Paper
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A 10μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications, from the CEA Leti.

 Full article
Conference Proceeding
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Process and Equipment Enhancements for C2W bonding in a 3D Integration Scheme, from SET North America.

 Full article
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