Thanks to the variety of the applications we address, and the high performance of our equipment, 2008 will be a positive year, despite the decrease forecasted by SEMI for the Semiconductor Equipment Market. SET has recently developed a Large Device Press for bonding light or radiation detectors, strengthening its leading position in the IR-FPA market. SET also pursues efforts in NIL and CNR Catania has reported results obtained with the SET FC150 NIL. Finally, SET reinforces collaboration with leading Research Institutes for 3D-IC. Enjoy reading this news.

Among all the Device Bonding applications, the assembly of Infrared Focal Plane Array (IRFPA) counts within the most challenging. The infrared is a type of “light” that is outside the range of the human eye. IRFPA is similar to the imaging chip in a digital camera, except it is sensitive to infrared instead of visible light.

F. Giannazzo, S. Di Franco, V. Rainari, CNR-IMM, Stradale 50, 95121 Catania, Italy

Abstract: In this paper, we report the results obtained by the application of the SET FC150 equipment for UV Nanoimprinting Lithography (UV-NIL), using nanostructured quartz molds, which where properly functionalized by an antisticking treatment.

For a couple of years, SET is discussing thoroughly with the various component assembly actors the "More-than-Moore" 3D integration concept which is expected to maintain Moore\'s Law. The development of 3D IC solutions is driven by form factor, performances, power consumption, heterogeneous integration and cost...

Visit SET at the upcoming exhibitions and conferences:

• Micronora, September 23-26, Besançon, France, Booth #511
• Semicon Europa, October 7-9, Stuttgart, Germany, Booth #1448
• Imaps 2008, November 2-6, Providence, Rhode Island, USA, Booth #639
• Semicon Japan, December 3-5, Chiba, Japan, JETRO Zone