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  Newsletter n°2
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Explore the World of Absolute Bonding Precision

 Word of the Managing Director

Thanks to the variety of the applications we address, and the high performance of our equipment, 2008 will be a positive year, despite the decrease forecasted by SEMI for the Semiconductor Equipment Market. SET has recently developed a Large Device Press for bonding light or radiation detectors, strengthening its leading position in the IR-FPA market. SET also pursues efforts in NIL and CNR Catania has reported results obtained with the SET FC150 NIL. Finally, SET reinforces collaboration with leading Research Institutes for 3D-IC. Enjoy reading this news.


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 Product Zoom: LDP150 for IR-FPA Applications

Among all the Device Bonding applications, the assembly of Infrared Focal Plane Array (IRFPA) counts within the most challenging. The infrared is a type of “light” that is outside the range of the human eye. IRFPA is similar to the imaging chip in a digital camera, except it is sensitive to infrared instead of visible light.



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UV NIL Application
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UV NIL Using Nanostructured Quartz Molds with Anti-sticking Functionalization, from CNR-IMM.

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3D IC Integration
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3D-IC Integration Development by SET.

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Exhibitions
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Visit SET at the upcoming exhibitions and conferences.

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Exhibitions & confĂ©rences send to a friend  
 
SET
Smart Equipment Technology

131, impasse Barteudet - BP 24
74490 Saint Jeoire - France
Visit us on www.set-sas.fr
Phone: +33 (0)4 50 35 83 92
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