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Newsletter n°3
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Explore the World of Absolute Bonding Precision

Word of the Managing Director

The JDP signed with IMEC strengthens SET's involvement in global research efforts hold in the field of the 3D wafer-level packaging and 3D stacked-ICs to explore innovative solutions for the cost-effective use of 3D interconnects. Through the delivery of the FC300 (first quarter of 2009), SET maintains its leadership position based on several decades of die bonding expertise and its commitment to offer unsurpassed sub-micron bonding capabilities combined with superior flexibility. Enjoy reading this newsletter!

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JDP signed with IMEC on 3D-ICs research

S.E.T., Smart Equipment Technology, a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions will collaborate with IMEC, one of Europe’s leading independent nanoelectronics research institutes, on the development of die pick-and-place and bonding processes for 3D chip integration, using S.E.T's FC300 High Force & High Accuracy Device Bonder.



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Conference Proceeding
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Assembly Strategies for 3D-IC Integration: Wafer to Wafer vs Chip to Wafer.
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Technical Paper
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3D Stacked IC Demonstration using a Through Silicon Via First Approach.
 Full article
Innovation Award
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S.E.T. received the Georg-Waeber-Prize for Innovation 2008.
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