SET NEWSLETTER

Newsletter n°4

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Insights
Explore the world of absolute precision

Word of the Managing Director, Gaël Schmidt

"By joining the IMEC Industrial Affiliation Program (IIAP) on 3D integration, SET is confirming its leadership position within the industry by providing cutting-edge high accuracy bonding solutions. Thanks to a close cooperation with its customers, SET has raised process development and flexibility of its equipment to the highest level. The SET's commitment to partner with technology leaders, which we thank for their confidence, is reflected by the technical content of the SET Insights. I hope that you will enjoy reading this July issue."

	SET & ITC Enter Agreement on Demo Capabilities

	SET North America and Infotonics Technology Center (ITC) of Canandaigua, NY, have entered into a cooperating agreement which strengthen the position of both companies as well as the bonding community. In the agreement, ITC’s facility will serve as a base location for demonstrations and development work on SET’s Bonders. Full article

Technical Paper

"New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels
Imaging Array", from CEA – LETI, MINATEC.

=> Flip chip is a high-density and highly reliable interconnection technology which is mandatory for the fabrication of high end heterogeneous imaging arrays. This paper describes two new flip chip technologies that can address the challenges at the 10 μm pitch node...

Full article

Conference Proceeding

"High accuracy placement, and in-situ reflow or thermo-compression bonding enabling high density and fine pitch in 3D-IC with chip to wafer bonding approach."

=> With the advent of 3D-IC and the increased packaging density, the introduction of Through Silicon Via technology and the associated high accuracy placement and bonding challenges introduce new requirements to make chip-to-wafer population a reality.

Full article

Technical Paper

"RF MEMS and flip-chip for space flight demonstrator", from Thalès Alenia Space.

=> The next generation of telecommunication satellites payloads will require higher performances and higher functionality for multimedia applications with still stronger constraints on cost and size. That means higher operating frequencies (Ka band), higher flexibility, (reconfigurability, on board processing...) and further miniaturization.

Full article

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About SET

SET Smart equipment Technology, a wholly owned subsidiary of Replisaurus Technologies, is as world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer bonding and Nanoimprint Lithography solutions. With several hundred Device Bonders installed worldwide. SET is renowned for the unsurpassed placement accuracy and the high flexibility of its Die Bonders & Flip Chip Bonders. The product portfollio ranges from the KADETT semi-automated R&D Device Bonder, through the automated FC150, the production FC250 and the the FC300, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm.

SET
Smart Equipment Technology S.A.S.
131, impasse Barteudet - BP 24
74490 Saint Jeoire - France

Visit us on www.set-sas.fr
Phone: +33 (0)4 50 35 83 92
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