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  Newsletter n°5
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Explore the World of Absolute Bonding Precision

 Word of the Managing Director, Gaël Schmidt.

Despite the economy slow down, SET continued to invest massively in R&D projects in order to stay at the forefront of the technological innovation. Due to this constant dedication, SET is proud to bring to market emerging applications and develop new technologies in partnership with its customers. And I thank them for their long-standing confidence. I wish you a good reading, and also a Merry Christmas and a Successful 2010 Year!


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 KADETT - Accurate Placement & Bonding Platform

The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments. The University of Cambridge presented at ACP2009 a paper describing the assembly of Liquid Crystal on Silicon (LCoS) Devices. The process was performed with a KADETT...



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Technical Paper
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A Fluxless Bonding Process using AuSn or Indium for a Miniaturized Hermetic Package, from CEA LETI and INTEXYS PHOTONICS.

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Technical Paper
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Electrically Yielding Collective Hybrid Bonding for 3D Stacking of ICs, from IMEC.

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SET Technical Bulletin N°3
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