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Word of the Managing Director, Gaël Schmidt.
Despite the economy slow down, SET continued to invest massively in R&D projects in order to stay at the forefront of the technological innovation. Due to this constant dedication, SET is proud to bring to market emerging applications and develop new technologies in partnership with its customers. And I thank them for their long-standing confidence. I wish you a good reading, and also a Merry Christmas and a Successful 2010 Year!
The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments. The University of Cambridge presented at ACP2009 a paper describing the assembly of Liquid Crystal on Silicon (LCoS) Devices. The process was performed with a KADETT...