SET NEWSLETTER

Newsletter n°5

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Insights
Explore the world of absolute precision

Word of the Managing Director, Gaël Schmidt.

Despite the economy slow down, SET continued to invest massively in R&D projects in order to stay at the forefront of the technological innovation. Due to this constant dedication, SET is proud to bring to market emerging applications and develop new technologies in partnership with its customers. And I thank them for their long-standing confidence. I wish you a good reading, and also a Merry Christmas and a Successful 2010 Year!

	KADETT - Accurate Placement & Bonding Platform

	The KADETT from SET is a semi automatic die bonder and flip chip bonder enabling the assembly of devices on a wide variety of substrates. It is particularly well suited for Research & Development laboratories, as well as pre-production environments. The University of Cambridge presented at ACP2009 a paper describing the assembly of Liquid Crystal on Silicon (LCoS) Devices. The process was performed with a KADETT... Full article

Technical Paper

=> A Fluxless Bonding Process using AuSn or Indium for a Miniaturized Hermetic Package, from CEA LETI and INTEXYS PHOTONICS.

"In the field of high speed data transmissions or in the industrialisation of MEMS devices a hermetic package is often required. However this technological achievement represents an important part of the package price and usually limits the freedom of design and miniaturization."

Full article

Technical Paper

=> Electrically Yielding Collective Hybrid Bonding for 3D Stacking of ICs, from IMEC.

"The production of non-monolithic 3D-systems by stacking and interconnecting components through substrate vias is intrinsically limited to the stacking of thin dies, typically ranging from 100 μm down to 15 μm. Since dies or wafers of such thickness are no longer rigid, it is an important requirement that the bond guarantees mechanical stability and rigidity..."

Full article

SET Technical Bulletin N°3

=> Make sure you get YOUR free electronic copy!

The free SET Technical Bulletin is a compilation of flip chip and die bonding technical articles. Each article provides unique insights into the exciting area of the 3D packaging by die-to-die and die-to-wafer bonding techniques.

To request a copy of the SET Technical Bulletin N°3, please register first...

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About SET

SET Smart equipment Technology, a wholly owned subsidiary of Replisaurus Technologies, is as world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer bonding and Nanoimprint Lithography solutions. With several hundred Device Bonders installed worldwide. SET is renowned for the unsurpassed placement accuracy and the high flexibility of its Die Bonders & Flip Chip Bonders. The product portfollio ranges from the KADETT semi-automated R&D Device Bonder, through the automated FC150, the production FC250 and the the FC300, SET offers a continuous process path from research to production. SET bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm.

SET
Smart Equipment Technology S.A.S.
131, impasse Barteudet - BP 24
74490 Saint Jeoire - France

Visit us on www.set-sas.fr
Phone: +33 (0)4 50 35 83 92
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