Multi-usable, Adhesively Bonded UV-NIL Templates, from the Dresden University of Technology.

 Since the mid 1990s many efforts were put into improvement of nanoimprinting. The main improvements comprised imprint tooling and resist systems. Besides the use in microelectronics lithography, nanoimprinting is also very promising as a MEMS technology. MEMS have highly different requirements compared to microelectronic applications and even higher demands on cost reduction. Nanoimprinting is seen as a cost effective technology for resolutions beyond 50 nm and is thus per se very attractive for MEMS research and industry. Nanoimprint templates are a major cost factor, especially for prototyping and technology development. Reduced template costs are therefore highly desired...

Die-to-Wafer bonding of thin dies using a 2-Step approach; High Accuracy Placement, then Gang Bonding, by Gilbert Lecarpentier from SET.

 25 um thick dies, mounted on thick carrier die, were placed on a 300 mm landing wafer using the High Accuracy Die Bonder SET FC300. The bonding process was either Cu/Cu or Cu/Sn with respective pitch of 10 µm and 40 µm...

3D Progress and Problems, by George Riley from Flipchips.com.

 Higher density 3D with direct die-to-die interconnection has been a major industry goal for the past decade. As transistors shrink towards horizontal scaling limits, growing vertically is an attractive alternative. Direct local die to die vertical connection of internal circuit elements with heterogeneous integration and repartitioning is the final goal...

Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration using a Fluxing Adhesive, from RTI International and Lord Corporation.

 We present the results of a study to evaluate of a fluxing adhesive developed by LORD Corp. in the bonding of Cu/Sn-Cu bump structures for interconnection in 3D integration structures...