Insights
Explore the World of Absolute Bonding Precision
The word of Gilbert Lecarpentier, International Product Manager
I would like to express my gratitude to the growing number of our readers for their on-going interest. To establish an exchange I invite you to participate in an on-line discussion forum the 3D InCites website, on May 3-7. The topic is Interconnect methods for TSV: Chip-to-Chip, Chip-to-Wafer, Wafer-to-Wafer. This discussion will give you the rare opportunity to ask any technical questions regarding the 3D-IC process challenges you have to face in your daily work. I am looking forward to blogging with you!
Multi-usable, Adhesively Bonded UV-NIL Templates,from the Dresden University of Technology.
Since the mid 1990s many efforts were put into improvement of nanoimprinting. The main improvements comprised imprint tooling and resist systems. Besides the use in microelectronics lithography, nanoimprinting is also very promising as a MEMS technology. MEMS have highly different requirements compared to microelectronic applications and even higher demands on cost reduction. Nanoimprinting is seen as a cost effective technology for resolutions beyond 50 nm and is thus per se very attractive for MEMS research and industry. Nanoimprint templates are a major cost factor, especially for prototyping and technology development. Reduced template costs are therefore highly desired...